Rittal: How to dissipate heat from control cabinet enclosures

In addition to negative external influences such as contaminated or humid ambient air and dust, heat is the number one enemy of electronic and microelectronic components. While electronics heat loss has diminished significantly in recent years, the packing density inside enclosures has increased dramatically, resulting in 50% to 60% increases in enclosure heat. When electronic components operate above their maximum temperate ratings, the service life of the components can be halved and the failure rate doubled.

Please click HERE to learn more from Rittal about how to successfully dissipate heat within an industrial enclosure.

Sections of Interest

Fundamental principles

Active heat dissipation

Tips for project planning and operation

Julyann Tu is an application engineer for AWC, Inc. in the Houston, TX office. She is a Certified Siemens Technology Specialist for Factory Automation and a SITRAIN Certified Instructor for TIA Portal Programming 1. With over 8 years of experience in industrial automation, she has a BS in Industrial Engineering from Texas A&M University and an MBA from University of Houston-Clear Lake.

Julyann Tu

App Engineer/
Tech Support

Julyann Tu

App Engineer/
Tech Support

Julyann Tu is an application engineer for AWC, Inc. in the Houston, TX office. She is a Certified Siemens Technology Specialist for Factory Automation and a SITRAIN Certified Instructor for TIA Portal Programming 1. With over 8 years of experience in industrial automation, she has a BS in Industrial Engineering from Texas A&M University and an MBA from University of Houston-Clear Lake.
Leave a Reply

Your email address will not be published. Required fields are marked *